Sputtering Equipment

This is a film deposition system that utilizes the sputtering phenomenon in which Ar ions collide with the target under plasma discharge, and the target material ejected by the collision are deposited on the substrate as a film.
As a related matter, we also introduce Annealing equipment to enhance the quality of the film after the deposition process.

  • SSP1000

    Desk-Top model as a low end model and it can select the deposition direction.

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  • SSP2000Plus

    Expandable Dual-cathode slim tower

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  • SSP2500G

    Dual cathode model with glove box. Auto-matcher is standard.

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  • SSP3000

    Triple cathode, substrate heating MAX800 ℃, film thickness distribution ± 3%

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  • SSP3000Plus

    Triple cathode, substrate heating up to Max.800℃, film thickness distribution ±3%, Expandable type.

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  • SAN1000

    Pressure control during heat treatment (annealing) to the substrate and heat treatment by introducing inert gas is possible.

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  • SAN2000Plus

    The temperature control of Max.1000deg.C is achievable and RF power source can be equipped with and the combination with other systems can be possible.

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